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3D Stacked Chips: From Emerging Processes to Heterogeneous Systems

by Ibrahim (Abe) M. Elfadel,Gerhard Fettweis

ISBN 13: 9783319793054

Format: Paperback (364 pages)
Publisher: Springer
Published: 06 Jun 2018

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The IoT Physical Layer: Design and Implementation (Analog Circuits and Signal Processing)

by Ibrahim (Abe) M. Elfadel,Mohammed Ismail

ISBN 13: 9783030065881

Format: Paperback (416 pages)
Publisher: Springer
Published: 19 Jan 2019

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